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专利名称：ROUGHENED COPPER FOIL, COPPER CLAD
LAMINATE, AND PRINTED CIRCUIT BOARD
发明人：Satoshi MOGI,Hiroaki TSUYOSHI申请号：US15528872申请日：20160406
公开号：US20180223412A1公开日：20180809
摘要：There is provided a roughened copper foil which can significantly improveadhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). Theroughened copper foil of the present invention has at least one roughened surfacehaving fine irregularities composed of acicular crystals, wherein the entire surface of theacicular crystals is composed of a mixed phase of Cu metal and CuO.
申请人：MITSUI MINING & SMELTING CO., LTD.
地址：Tokyo JP
国籍：JP
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