Wafer Bonding Method

专利名称：Wafer Bonding Method

发明人：Yung-Chi Lin,Tsang-Jiuh Wu,Wen-Chih

Chiou,Chen-Hua Yu

申请号：US17019913申请日：20200914

公开号：US20210305200A1公开日：20210930

专利附图：

摘要：In an embodiment, a device includes: a first wafer including a first substrate anda first interconnect structure, a sidewall of the first interconnect structure forming anobtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first

wafer, the second wafer including a second substrate and a second interconnectstructure, the sidewall of the first substrate being laterally offset from a sidewall of thesecond substrate and a sidewall of the second interconnect structure.

申请人：Taiwan Semiconductor Manufacturing Co., Ltd.

地址：Hsinchu TW

国籍：TW

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