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专利名称：Electronic Component, Optoelectronic
Component, Component Arrangement, andMethod for Producing an ElectronicComponent
发明人：Luca Haiberger,Matthias Sperl申请号：US15502188申请日：20150804
公开号：US20170222094A1公开日：20170803
专利附图：
摘要：An electronic component, an optoelectronic component, a component
arrangement, and a method for producing an electronic component are disclosed. In anembodiment, the method includes forming a sacrificial structure on a top side of a carrierby a photolithographic process from a photoresist layer, arranging an electronicsemiconductor chip on the carrier after exposing the photoresist layer, molding amolded body around the sacrificial structure and around the electronic semiconductorchip such that a surface of the electronic semiconductor chip is at least partly notcovered by the molded body, detaching the molded body from the carrier and removingthe sacrificial structure, wherein removing the sacrificial structure results in a cutout beingformed in the molded body.
申请人：OSRAM Opto Semiconductors GmbH
地址：Regensburg DE
国籍：DE
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