专利内容由知识产权出版社提供
专利名称：Ball grid array package with an
electromagnetic shield connected directlyto a printed circuit board
发明人：Chia-Ming Hsieh申请号：US10761724申请日：20040120
公开号：US20040150977A1公开日：20040805
专利附图：
摘要：A ball grid array package includes a chip having a substrate with a bottomsurface, a plurality of solder bumps projecting outwardly from the bottom surface of the
substrate, and an electromagnetic shield including a housing that defines an inner spacewhich receives the chip and the solder bumps therein, and a bottom opening for accessinto the inner space. The solder bumps project outwardly of the inner space through thebottom opening in the housing.
申请人：HSIEH CHIA-MING
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