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专利名称：Package-on-package structure and method
of forming same
发明人：Chih-Wei Lin,Wen-Hsiung Lu,Hsuan-Ting
Kuo,Wei-Yu Chen,Ming-Da Cheng,Chung-ShiLiu
申请号：US13901084申请日：20130523公开号：US09287203B2公开日：20160315
专利附图：
摘要：A device comprises a bottom package comprising interconnect structures, first
bumps on a first side and metal bumps on a second side, a semiconductor die bonded onthe bottom package, wherein the semiconductor die is electrically coupled to the firstbumps through the interconnect structures. The device further comprises a top packagebonded on the second side of the bottom package, wherein the top package comprisessecond bumps, and wherein each second bump and a corresponding metal bump form ajoint structure between the top package and the bottom package and an underfill layerformed between the top package and the bottom package, wherein the metal bumps areembedded in the underfill layer.
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地址：Hsin-Chu TW
国籍：TW
代理机构：Slater & Matsil, L.L.P.
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