专利内容由知识产权出版社提供
专利名称：FABRICATION OF INTERCONNECT
STRUCTURES
发明人：HUANG, Elbert, E.,KIM, Hyungjun,MILLER,
Robert, D.,NITTA, Satyanarayana,V.,PURUSHOTHAMAN, Sampath
申请号：EP057539.2申请日：20050523公开号：EP1761946A2公开日：20070314
摘要：Interconnect structures are fabricated by methods that comprise depositing athin conformal passivation dielectric and/or diffusion barrier cap and/or hard mask by anatomic layer deposition or supercritical fluid based process.
申请人：International Business Machines Corporation
地址：New Orchard Road Armonk, N.Y. 10504 US
国籍：US
代理机构：Litherland, David Peter
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