专利内容由知识产权出版社提供
专利名称：Flip-chip type semiconductor device,
production process for manufacturing suchflip-chip type semiconductor device, andproduction process for manufacturingelectronic product using such flip-chip typesemiconductor device
发明人：Yoichiro Kurita,Rieka Ouchi,Takashi
Miyazaki,Toshiyuki Yamada
申请号：US10919411申请日：20040817
公开号：US20050040541A1公开日：20050224
专利附图：
摘要：A flip-chip type semiconductor device includes a semiconductor substrate. Aplurality of electrode terminals are provided and arranged on a top surface of thesemiconductor substrate, a sealing resin layer is formed on the top surface of thesemiconductor substrate such that the electrode terminals are completely covered withthe sealing resin layer.
申请人：Yoichiro Kurita,Rieka Ouchi,Takashi Miyazaki,Toshiyuki Yamada
地址：Kawasaki-shi JP,Kawasaki-shi JP,Kawasaki-shi JP,Kawasaki-shi JP
国籍：JP,JP,JP,JP
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