Semiconductor device with flip-chip structure and

专利名称：Semiconductor device with flip-chip

structure and method of manufacturing thesame

发明人：YOSHIDA AKITO申请号：US87065497申请日：19970606公开号：US45001B2公开日：20020903

摘要：A semiconductor device has a plurality of input/output terminals formed on theinner region on a semiconductor substrate, and a plurality of die testing terminalsformed on the peripheral region on the semiconductor substrate, and the input/outputterminals and the die testing terminals are connected to each other by a metal wiringlayer. Die testing is performed by bringing probes projecting from a probe card intocontact with the plurality of die testing terminals.

申请人：KABUSHIKI KAISHA TOSHIBA

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