Flip-chip semiconductor package and chip carrier f

专利名称：Flip-chip semiconductor package and chip

carrier for preventing corner delamination

发明人：Yuan-Lin Tzeng,Nai-Hao Kao,Jeng-Yuan

Lai,Yu-Po Wang,Cheng-Hsu Hsiao

申请号：US11880467申请日：20070720公开号：US08207620B2公开日：20120626

专利附图：

摘要：The present invention discloses a flip-chip semiconductor package and a chipcarrier thereof. The chip carrier includes a groove formed around a chip-mounting area.The groove may be formed along a periphery of the chip-mounting area or at cornersthereof. The groove is filled with a filler of low Young's modulus so as to absorb andeliminate thermal stress, thereby preventing delamination between an underfill and a flipchip mounted on the chip-mounting area.

申请人：Yuan-Lin Tzeng,Nai-Hao Kao,Jeng-Yuan Lai,Yu-Po Wang,Cheng-Hsu Hsiao

地址：Taichung Hsien TW,Taichung Hsien TW,Taichung Hsien TW,Taichung Hsien

TW,Taichung Hsien TW

国籍：TW,TW,TW,TW,TW

代理机构：Edwards Wildman Palmer LLP

代理人：Peter F. Corless,Steven M. Jensen

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