FDC6331L;中文规格书,Datasheet资料

FDC6331LAugust2001April 2007tmFDC6331LIntegrated Load SwitchGeneral DescriptionThis device is particularly suited for compact power management in portable electronic equipment where 2.5V to 8V input and 2.8A output current capability are needed. This load switch integrates a small N-Channelpower MOSFET (Q1) thatdrives a large P-Channelpower MOSFET (Q2) in one tiny SuperSOTTM-6package.Applicationsx󰀃Loadswitchx󰀃Power managementFeaturesx󰀃–2.8 A, –8 V.RDS(ON) = 55 m: @ VGS = –4.5 VRDS(ON) = 70 m: @ VGS = –2.5 VRDS(ON) = 100m:󰀃@ VGS = –1.8 Vx󰀃Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6KV Human body model)x󰀃High performance trench technology for extremely low RDS(ON)D2S1D1Vin,R1ON/OFFQ2Equivalent Circuit32Q1456Vout,C1INVout,C1R2+V–DROPOUTG2SuperSOT -6Pin 1TMS2G1R1,C11SeeApplicationCircuitON/OFFSuperSOT™-6Absolute Maximum RatingsSymbolVINVON/OFFILoadPDTJ, TSTGTA=25oC unless otherwise notedParameterMaximum Input Voltage High level ON/OFF voltage rangeLoad Current– Continuous– PulsedMaximumPower Dissipation (Note1)(Note 1)Ratings r8–0.5 to 82.890.7–55 to +150UnitsVVAWqCOperating and Storage Junction Temperature RangeThermal CharacteristicsRTJARTJCThermal Resistance, Junction-to-AmbientThermal Resistance, Junction-to-Case(Note 1)(Note 1)18060qC/WqC/WPackage Marking and Ordering InformationDevice Marking.331DeviceFDC6331LReel Size7’’Tape width8mmQuantity3000 units󰂔2007Fairchild Semiconductor CorporationFDC6331L Rev D

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FDC6331LElectrical CharacteristicsSymbolParameterTA = 25°C unless otherwise notedTest ConditionsMinTypMaxUnitsOff CharacteristicsBVINILoadIFLIRLVON/OFF (th)RDS(on)Vin Breakdown Voltage Zero Gate Voltage Drain CurrentLeakage Current, ForwardLeakage Current, Reverse(Note 2)VON/OFF = 0 V, ID = –250PAVIN = 6.4 V,VON/OFF = 0 VVON/OFF = 0 V, VIN = 8 V VON/OFF = 0 V,VIN = –8 VVIN = VON/OFF, ID = –250PAVGS = –4.5 V,ID = –2.8AID = –2.5 AVGS = –2.5 V, ID = –2.0 AVGS = –1.8 V,VGS = 4.5 V, ID = 0.4AID = 0.2 AVGS = 2.7 V,8–1–1001000.40.93445643.13.81.5557010045VPAnAnAVm:On CharacteristicsGate Threshold VoltageStatic Drain–SourceOn–Resistance (Q2)Static Drain–SourceOn–Resistance (Q1)RDS(on):Drain–Source Diode Characteristics and Maximum RatingsISVSDMaximum Continuous Drain–Source Diode Forward CurrentDrain–Source Diode Forward VoltageVON/OFF = 0 V,IS = –0.6 A(Note 2)–0.6–1.2AVNotes:1. R TJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R TJC is guaranteed by design while R TJA is determined by the user’s board design.2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.FDC6331L Load Switch Application CircuitINR1Q2C1OUTQ1ON/OFFLOADR2External Component Recommendation: For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030.FDC6331LRev D

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FDC6331L0.40.350.30.250.20.150.10.0500123IL, (A)456TJ = 25OCVIN = 1.8VVON/OFF= 1.5V -8VPW = 300us, D < 2%0.40.35TJ = 125OCVDROP, (V)0.30.250.20.150.10.0500VIN = 2.5VVON/OFF= 1.5V -8VPW = 300us, D < 2%VDROP, (V)TJ = 125OCTJ = 25OC123IL, (A)456Figure 1. Conduction Voltage DropVariation with Load Current.0.40.350.3VDROP, (V)0.250.20.150.10.0500123IL, (A)456TJ = 125OCVIN = 4.5VVON/OFF= 1.5V -8VPW = 300us, D < 2%0.15Figure 2. Conduction Voltage DropVariationwith Load Current.Q2R, ON-RESISTANCE ()0.1250.1I = 1AV = 1.5V -8VPW = 300us, D < 2%0.075T = 125OC0.05T = 25OC0.02501234-V,GATE TO SOURCE VOLTAGE (V)5TJ = 25OCFigure 3. Conduction Voltage DropVariation with Load Current.1r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCED = 0.5Figure 4. On-Resistance VariationWith Input VoltageRTJA(t) = r(t) + RTJARTJA = 156 °C/WP(pk)t1t2TJ - TA = P * RTJA(t)Duty Cycle, D = t1/ t20.01SINGLE PULSE0.20.10.10.050.020.010.00010.0010.010.11101001000Figure 5. Transient Thermal Response Curve.Thermal characterization performed on the conditions described in Note 2. Transient thermal response will change depends on the circuit board design.FDC6331LRev D

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tmTRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.ACEx®Across the board. Around the world™ActiveArray™Bottomless™Build it Now™CoolFET™CROSSVOLT™CTL™Current Transfer Logic™DOME™E2CMOS™EcoSPARK®EnSigna™FACT Quiet Series™FACT®FAST®FASTr™FPS™FRFET®GlobalOptoisolator™GTO™HiSeC™i-Lo™ImpliedDisconnect™IntelliMAX™ISOPLANAR™MICROCOUPLER™MicroPak™MICROWIRE™MSX™MSXPro™OCX™OCXPro™OPTOLOGIC®OPTOPLANAR®PACMAN™POP™Power220®Power247®PowerEdge™PowerSaver™PowerTrench®Programmable Active Droop™QFET®QS™QT Optoelectronics™Quiet Series™RapidConfigure™RapidConnect™ScalarPump™SMART START™SPM®STEALTH™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TCM™The Power Franchise®™TinyBoost™TinyBuck™TinyLogic®TINYOPTO™TinyPower™TinyWire™TruTranslation™μSerDes™UHC®UniFET™VCX™Wire™DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.󰀃PRODUCT STATUS DEFINITIONSDefinition of Terms2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.󰀃Datasheet IdentificationAdvance InformationProduct Status Formative or In DesignDefinitionThis datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes at any time without notice to improve design.󰀃This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor.The datasheet is printed for reference information only.Preliminary First ProductionNo Identification Needed Full ProductionObsolete Not In Production Rev. I24©2007 Fairchild Semiconductor Corporation

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