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®ESDA6V1BC6
QUAD BIDIRECTIONAL TRANSIL™SUPPRESSOR FOR ESD PROTECTION
ASD™
MAIN APPLICATIONS
Where transient overvoltage protection in ESDsensitive equipment is required, such as:Computers■Printers
■Communication systems■Video equipment
This device is particularly adapted to the protec-tion of symmetrical signals
■
SOT23-6LFEATURES
■4 Bidirectional Transil functions
■ESD Protection for data, Signal and VCC Bus
■■■
Stand off voltage range: ± 5 V Low leakage current < 1µA
Peak pulse power (8/20µs); 80W
Table 1: Order Code
Part NumberESDA6V1BC6
MarkingBS55
DESCRIPTION
The ESDA6V1BC6 is a monolithic array designedto protect up to 4 lines in a bidirectional wayagainst ESD transients.
The device is ideal for situations where boardspace is at a premium.
BENEFITS
■High ESD protection level: up to 25kV■High integration
■Suitable for high density boards
COMPLIES WITH THE FOLLOWING STANDARDS:
■
Figure 1: Functional Diagram
123654IEC61000-4-2 level 4:
15kV(air discharge)
8kV(contact discharge)MIL STD 883E-Method 3015-6: class3
(Human Body Model)
■
TM: ASD is a trademark of STMicroelectronics.
November 2004REV. 21/6
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ESDA6V1BC6
Table 2: Absolute Maximum Ratings (Tamb = 25°C)SymbolParameterMIL STD 883C - Method 3015-6VPPESD dischargeIEC61000-4-2 air discharge
IEC61000-4-2 contact discharge
PPPPeak pulse power (8/20µs) TjJunction temperatureTstgTLTop
Storage temperature rangeMaximum lead temperature for soldering during 10 s at 5mm for case
Operating temperature range (note 1)
Value2515880150-55 to +150260-40 to +125
UnitkVW°C°C°C°C
Note 1: Variation of parameters is given by curves.
Table 3: Electrical Characteristics (Tamb = 25°C)SymbolParameterVRMStand-off voltageVBRBreakdown voltageVCLIRMIPPαTVFCRd
Clamping voltageLeakage current
Peak pulse currentVoltage temperature coefficientForward voltage dropCapacitanceDynamic resistance
VBR @Type
min.V
ESDA6V1BC66.1Note 2: Square pulse, IPP = 3A, tp=2.5µs.
IVBRVCLVRMIRMVRdIPP IRIRM @ VRMmax.
Rdtyp.note 2
max.V8mA1αTmax.10-4/°C3Ctyp.0V biaspF20µA1V5Ω1.35Figure 2: Relative variation of peak pulsepower versus initial junction temperature
PPP[Tjinitial] / PPP[Tjinitial=25°C]1.11.00.90.80.70.60.50.40.30.20.10.00255075100125150175Figure 3: Peak pulse power versus exponentialpulse duration
PPP(W)500100Tj(°C)101tp(µs)101002/6
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ESDA6V1BC6
Figure 4: Clamping voltage versus peak pulsecurrent (typical values, rectangular waveform)
IPP(A)20.010.0Figure 5: Junction capacitance versus linevoltage applied (typical values
C(pF)F = 1MHzVOSC= 30mVT= 25°C222120191817161.015141312VCL(V)0.1051015202530tp= 2.5µsTinitial = 25°C1110VR(V)0123456783540Figure 6: Relative variation of leakage currentversus junction temperature (typical values)
IR[Tj] / IR[Tj=25°C]50010010Tj(°C)12550751001251501. ESD protection by ESDA6V1-4BC6
With the focus of lowering the operation levels, the problem of malfunction caused by the environment iscritical. Electrostatic discharge (ESD) is a major cause of failure in electronic system.
Transient Voltage Suppressors are an ideal choice for ESD protection and have proven capable in sup-pressing ESD events. They are capable of clamping the incoming transient to a low enough level suchthat damage to the protected semiconductor is prevented.
Surface mount TVS arrays offer the best choice for minimal lead inductance.
They serve as parallel protection elements, connected between the signal line to ground. As the transientrises above the operating voltage of the device, the TVS array becomes a low impedance path divertingthe transient current to ground.
®
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ESDA6V1BC6
Figure 7: Bidirectional protection for 0V biased signals
DRIVERCONNECTORThe ESDA6V1BC6 array is the ideal product for use as board level protection of ESD sensitive semicon-ductor components.
The tiny SOT23-6L package allows design flexibility in the design of “crowded” boards where the spacesaving is at a premium. This enables to shorten the routing and can contribute to improve ESD perform-ance.
2. Circuit Board Layout
Circuit board layout is a critical design step in the suppression of ESD induced transients. The followingguidelines are recommended :
■■■■■
The ESDA6V1BC6 should be placed as near as possible to the input terminals or connectors.Minimise the path length between the ESD suppressor and the protected deviceMinimise all conductive loops, including power and ground loops
The ESD transient return path to ground should be kept as short as possible.Use ground planes whenever possible.
Figure 8: Ordering information schemeESDA 6V1 - B C6ESD ArrayBreakdownVoltage (min)6V1 = 6.1VoltType of protectionB = BidirectionalPackageC6 = SOT23-6L4/6
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ESDA6V1BC6
Figure 9: SOT23-6L Package Mechanical Data
DIMENSIONS
REF.
A2AMillimetersMin.
Typ.
Max.0.10
Min.0
0.9000.900.350.092.801.50
0.95
2.600.10
3.000.1020.600.00410°1.450.0351.300.0350.500.0140.200.0043.050.1101.750.059
InchesTyp.
Max.0.0570.0040.0510.020.0080.1200.069
0.037
0.1180.02410°A
DA1A2bCD
A1LbHθEEeH
eecLθFigure 10: Foot Print Dimensions (in millimeters)
0.60
1.20
3.50
2.30
0.95
1.10
Table 4: Ordering Information
Part NumberESDA6V1BC6
MarkingBS55
PackageSOT23-6L
Weight16.7 mg
Base qty3000
Delivery modeTape & reel
Table 5: Revision History
DateJan-20024-Nov-2004
Revision1A2
First issue.SOT23-6L package dimensions change for reference “D” from 3.0 millimeters (0.118 inches) to 3.05 millimeters (0.120 inches).
Description of Changes
®
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequencesof use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subjectto change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are notauthorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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