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专利名称：CHIP SCALE MODULE PACKAGE IN BGA
SEMICONDUCTOR PACKAGE
发明人：Leo A. Merilo,Emmanuel A. Espiritu,Dario S.
Filoteo,Rachel L. Abinan
申请号：US114699申请日：20060815
公开号：US20080042265A1公开日：20080221
专利附图：
摘要：A semiconductor package includes a ball grid array (BGA) substrate havingintegrated metal layer circuitry, a flip chip chip scale module package (CSMP) having a
first integrated passive device (IPD), the flip chip chip scale module package attached tothe ball grid array (BGA) substrate, and an application die attached to the integratedpassive device (IPD). A method of manufacturing a semiconductor package includesproviding a ball grid array (BGA) substrate having integrated metal layer circuitry,attaching a flip chip chip scale module package (CSMP) having a first integrated passivedevice (IPD) to the ball grid array (BGA) substrate, and attaching an application die to theintegrated passive device (IPD).
申请人：Leo A. Merilo,Emmanuel A. Espiritu,Dario S. Filoteo,Rachel L. Abinan
地址：Singapore SG,Singapore SG,Singapore SG,Singapore SG
国籍：SG,SG,SG,SG
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