Multi-layer printed wiring board and manufacturing

专利名称：Multi-layer printed wiring board and

manufacturing method thereof

发明人：Youhong Wu申请号：US11832673申请日：20070802公开号：US080036B2公开日：20110823

专利附图：

摘要：A multi-layer printed wiring board has a core substrate, a first interlayerinsulation layer formed over the core substrate, a first filled via formed in the firstinterlayer insulation layer, a second interlayer insulation layer formed over the first

interlayer insulation layer, and a second filled via formed in the second interlayerinsulation layer. The first filled via has a bottom portion having a first diameter. Thesecond filled via has a bottom portion having a second diameter smaller than the firstdiameter.

申请人：Youhong Wu

地址：Ibi-gun JP

国籍：JP

代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.

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