专利内容由知识产权出版社提供
专利名称：MANUFACTURING METHOD OF
SEMICONDUCTOR DEVICE AND
SEMICONDUCTOR DEVICE MANUFACTUREDTHEREBY
发明人：Jin Seong Kim,In Bae Park,Kwang Seok Oh申请号：US14477363申请日：20140904
公开号：US20150279811A1公开日：20151001
专利附图：
摘要：A method of manufacturing a semiconductor device that can be transferred to a
circuit board with improved product reliability, and a semiconductor device manufacturedaccording to the method, are described. A non-limiting example of the manufacturingmethod includes preparing a wafer having multiple semiconductor die portions formedon the semiconductor wafer, performing a sawing operation to separate the multiplesemiconductor die portions into multiple discrete semiconductor die, arranging themultiple discrete semiconductor die on an adhesive member, encapsulating the multiplesemiconductor die using an encapsulant, and performing a second sawing operation uponthe encapsulated multiple semiconductor die to produce multiple individualencapsulated semiconductor devices.
申请人：Amkor Technology, Inc.
地址：Chandler AZ US
国籍：US
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