专利名称:Wafer carrier positioning structure发明人:Takuji Nakatogawa申请号:US11812614申请日:20070620公开号:US07703609B2公开日:20100427
专利附图:
摘要:A wafer carrier positioning structure including a carrier body having a bottomface and a frame body provided in a peripheral part of the bottom face to projectdownwardly, for housing a wafer therein so that the wafer is parallel to the bottom face.Further, the wafer positioning structure includes a guide member detachably attached to
the bottom face of the carrier body, a guide groove provided in the guide member, forengaging with a positioning pin projecting from a mounting face upon mounting thecarrier body to the mounting face, so as to guide the carrier body to a regular mountingposition, and a locking portion provided in the guide member, locking to an inside face ofthe frame body while elastically having contact with the inside face.
申请人:Takuji Nakatogawa
地址:Ichihara JP
国籍:JP
代理机构:Wenderoth, Lind & Ponack, L.L.P.
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容
Copyright © 2019- huatuo9.cn 版权所有 赣ICP备2023008801号-1
违法及侵权请联系:TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务