专利内容由知识产权出版社提供
专利名称：METHODS OF FORMING ELECTRONIC
PACKAGES
发明人：KECK, STEVEN, DAVID,ROCAZELLA, MICHAEL,
ANGELO,ENGELGAU, PETER,MICHAEL,HANNON, GREGORY,
EUGENE,WHITE, DANNY, RAY,NAGELBERG,ALAN, SCOTT
申请号：US9101247申请日：19910225公开号：WO9113462A3公开日：19911017
摘要：The present invention relates to the formation of a macrocomposite body foruse as an electronic package or container. The macrocomposite body is formed byspontaneously infiltrating a permeable mass of filler material (247) or a preform withmolten matrix metal (250) and bonding the spontaneously infiltrated material to at leastone second material such as a ceramic or ceramic containing body and/or a metal ormetal containing body. Moreover, prior to infiltration, the filler material or preform isplaced into contact with at least a portion of a second material such that after infiltrationof the filler material or preform by molten matrix metal, the infiltrated material isbonded to said second material, thereby forming a macrocomposite body. Themacrocomposite body may then be coated by techniques according to the presentinvention to enhance its perfomance and/or bonding capabilities.
申请人：LANXIDE TECHNOLOGY COMPANY, LP
地址：1300 MARROWS ROAD;P.O. BOX 6077;NEWARK, DE 19714-6077
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