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专利名称：MOULDING COMPOUND发明人：MORATO VIA, Josep, Antoni申请号：EP95932971.0申请日：19950726公开号：EP07729A1公开日：19970514
摘要：Moulding compound comprising a thermosetting polymer, which may be athermoplastic polymer, one or more peroxide catalysts, fibrous reinforcing material anda mixture of different types of fillers, comprising a first type, filler I, which has a particlesize of less than 250 um, and a MOHS hardness of between 2 and 5, and a second type,filler II, which has a MOHS hardness of between 6 and 10, wherein said filler II a particlesize smaller than 20 um and in that the molding compound also contains a third type offiller III that a color filler having a MOHS hardness of between 2 and 5 and a largeparticle size or small than 1.25 mm.
申请人：DSM N.V.
地址：Het Overloon 1 11 TE Heerlen NL
国籍：NL
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