专利内容由知识产权出版社提供
专利名称：COF packaging structure, method of
manufacturing the COF packaging structure,and method for assembling a driver IC andthe COF packaging structure thereof
发明人：Chiu-Shun Lin,Pai-Sheng Cheng申请号：US12057387申请日：20080328公开号：US07906374B2公开日：20110315
专利附图：
摘要：A COF packaging structure includes a substrate, a first conductive foil, and a
second conductive foil. The substrate has a first surface and a second surface opposite tothe first surface. The first conductive foil is disposed on the first surface of the substrateand has a first designated pattern for bump bonding. The second conductive foil isdisposed on the second surface of the substrate and has a second designated pattern,wherein the area of the second designated pattern is not smaller than the area of thefirst designated pattern.
申请人：Chiu-Shun Lin,Pai-Sheng Cheng
地址：Tainan County TW,Tainan County TW
国籍：TW,TW
代理人：Winston Hsu,Scott Margo
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